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INTEGRATED CIRCUITS
DATA SHEET
UBA2021 630 V driver IC for CFL and TL lamps
Product specification Supersedes data of 2000 Jul 24 File under Integrated Circuits, IC11 2001 Jan 30
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
FEATURES * Adjustable preheat and ignition time * Adjustable preheat current * Adjustable lamp power * Lamp temperature stress protection at higher mains voltages * Capacitive mode protection * Protection against a too-low drive voltage for the power MOSFETs. QUICK REFERENCE DATA SYMBOL High voltage supply VFS Start-up state VVS(start) VVS(stop) IVS(standby) Preheat mode fstart tph VRS(ctrl) fB tign fB tno Itot start frequency preheat time control voltage at pin RS CCP = 100 nF - - - - - - - fB = 43 kHz - - - IRHV = 0.75 mA IRHV = 1.0 mA Ii(RHV) operating range of input current at pin RHV - - 0 108 666 -600 42.9 625 oscillator start voltage oscillator stop voltage standby current VVS = 11 V - - - 11.95 10.15 200 high side supply voltage IFS < 15 A; t < 0.5 s - - PARAMETER CONDITIONS MIN. TYP. GENERAL DESCRIPTION
UBA2021
The UBA2021 is a high-voltage IC intended to drive and control Compact Fluorescent Lamps (CFL) or fluorescent TL-lamps. It contains a driver circuit for an external half-bridge, an oscillator and a control circuit for starting up, preheating, ignition, lamp burning and protection.
MAX.
UNIT
630 - - - - - - - - - - - - - - - 1000
V
V V A kHz ms mV
Frequency sweep to ignition bottom frequency ignition time kHz ms
Normal operation bottom frequency non-overlap time total supply current 42.9 1.4 1 126 75 kHz s mA kHz kHz A
RG1(on), RG2(on) high and low side on resistance RG1(off), RG2(off) high and low side off resistance Feed-forward fff feed-forward frequency
63.6 84.5 -
2001 Jan 30
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Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME UBA2021T UBA2021P BLOCK DIAGRAM SO14 DIP14 DESCRIPTION plastic small outline package; 14 leads; body width 3.9 mm plastic dual in-line package; 14 leads (300 mil)
UBA2021
VERSION SOT108-1 SOT27-1
handbook, full pagewidth
VS 5
RHV 13
RREF CF 10 12
CI 14
bootstrap charging circuit SB
SUPPLY n.c. 4 BAND GAP REFERENCE 8 NON OVERLAP OSCILLATOR LEVEL SHIFTER HIGH SIDE DRIVER
1 2 3
FS G1 S1
CP
TIMING
LOW SIDE DRIVER
6
G2
RS
9
RS MONITOR
CONTROL
7
UBA2021
11
MGS988
PGND
SGND
Fig.1 Block diagram.
2001 Jan 30
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Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
PINNING
UBA2021
SYMBOL
FS G1 S1 n.c. VS G2 PGND CP RS RREF SGND CF RHV CI
PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14
gate high transistor (T1) source high transistor (T1)
DESCRIPTION
high side floating supply voltage
high-voltage spacer, not to be connected low voltage supply gate low transistor (T2) power ground timing/averaging capacitor current monitoring input reference resistor signal ground oscillator capacitor start-up resistor/feed-forward resistor integrating capacitor
handbook, halfpage
handbook, halfpage
FS G1 S1 n.c. VS G2 PGND
1 2 3 4 5 6 7
MGS989
14 CI 13 RHV 12 CF
FS G1 S1 n.c. VS G2 PGND
1 2 3 4 5 6 7
MGS990
14 CI 13 RHV 12 CF
UBA2021T 11 SGND
10 RREF 9 RS
UBA2021P 11 SGND
10 RREF 9 RS
8 CP
8 CP
Fig.2 Pin configuration (SO14).
Fig.3 Pin configuration (DIP14).
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Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
FUNCTIONAL DESCRIPTION Introduction
handbook, halfpage
UBA2021
MGS991
The UBA2021 is an integrated circuit for electronically ballasted compact fluorescent lamps and their derivatives operating with mains voltages up to 240 V (RMS). It provides all the necessary functions for preheat, ignition and on-state operation of the lamp. In addition to the control function, the IC provides level shift and drive functions for the two discrete power MOSFETs, T1 and T2 (see Fig.7). Initial start-up Initial start-up is achieved by charging capacitor CS9 with the current applied to pin RHV. At start-up, MOSFET T2 conducts and T1 is non-conducting, ensuring Cboot becomes charged. This start-up state is reached for a supply voltage VVS(reset) (this is the voltage level at pin VS at which the circuit will be reset to the initial state) and maintained until the low voltage supply (VVS) reaches a value of VVS(start). The circuit is reset in the start-up state. Oscillation When the low voltage supply (VVS) has reached the value of VVS(start) the circuit starts oscillating in the preheat state. The internal oscillator is a current-controlled circuit which generates a sawtooth waveform. The frequency of the sawtooth is determined by the capacitor CCF and the current out of pin CF (mainly set by RRREF). The sawtooth frequency is twice the frequency of the signal across the load. The IC brings MOSFETs T1 and T2 alternately into conduction with a duty factor of approximately 50%. Figure 4 represents the timing of the IC. The circuit block 'non-overlap' generates a non-overlap time tno that ensures conduction periods of exclusively T1 or T2. Time tno is dependent on the reference current IRREF.
start-up VCF 0 internal clock 0 V(G1-S1) 0 V(G2) 0 time t no t no
Fig.4 Oscillator timing.
Operation in the preheat mode The circuit starts oscillating at approximately 2.5 x fB (108 kHz). The frequency gradually decreases until a defined value of current Ishunt is reached (see Fig.5). The slope of the decrease in frequency is determined by capacitor CCI. The frequency during preheating is approximately 90 kHz. This frequency is well above the resonant frequency of the load, which means that the lamp is off; the load consists of L2, C5 and the electrode resistance only. The preheat time is determined by capacitor CCP. The circuit can be locked in the preheat state by connecting pin CP to ground. During preheating, the circuit monitors the load current by measuring the voltage drop over external resistor Rshunt at the end of conduction of T2 with decision level VRS(ctrl). The frequency is decreased as long as VRS > VRS(ctrl). The frequency is increased for VRS < VRS(ctrl).
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Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
Feed-forward frequency
UBA2021
handbook, halfpage
fstart
MGS992
fB preheat state ignition state burn state time
Above a defined voltage level the oscillation frequency also depends on the supply voltage of the half-bridge (see Fig.6). The current for the current-controlled oscillator is in the feed-forward range derived from the current through RRHV. The feed-forward frequency is proportional to the average value of the current through RRHV within the operating range of Ii(RHV), given the lower limit set by fB. For currents beyond the operating range (i.e. between 1.0 and 1.6 mA) the feed-forward frequency is clamped. In order to prevent feed-forward of ripple on Vin, the ripple is filtered out. The capacitor connected to pin CP is used for this purpose. This pin is also used in the preheat state and the ignition state for timing (tph and tign).
For calculations refer to Chapter "Design equations".
Fig.5 Operation in the preheat mode.
handbook, halfpage
MGS993
Ignition state The RS monitoring function changes from VRS(ctrl) regulation to capacitive mode protection at the end of the preheat time. Normally this results in a further frequency decrease down to the bottom frequency fB (approximately 43 kHz). The rate of change of frequency in the ignition state is less than that in the preheat mode. During the downward frequency sweep, the circuit sweeps through the resonant frequency of the load. A high voltage then appears across the lamp. This voltage normally ignites the lamp. Failure to ignite Excessive current levels may occur if the lamp fails to ignite. The IC does not limit these currents in any manner.
f (kHz) feed-forward range bottom frequency
IRHV (mA)
For calculations refer to Chapter "Design equations".
Fig.6 Feed-forward frequency.
Capacitive mode protection Transition to the burn state Assuming that the lamp has ignited during the downward frequency sweep, the frequency normally decreases to the bottom frequency. The IC can transit to the burn state in two ways: 1. In the event that the bottom frequency is not reached, transition is made after reaching the ignition time tign. 2. As soon as the bottom frequency is reached. The bottom frequency is determined by RRREF and CCF. When the preheat mode is completed, the IC will protect the power circuit against losing the zero voltage switching condition and getting too close to the capacitive mode of operation. This is detected by monitoring voltage VRS at pin RS. If the voltage is below VRS(cap) at the time of turn-on of T2, then capacitive mode operation is assumed. Consequently the frequency increases as long as the capacitive mode is detected. The frequency decreases down to the feed-forward frequency if no capacitive mode is detected. Frequency modulation is achieved via pin CI.
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Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
IC supply Initially, the IC is supplied from Vin by the current through RRHV. This current charges the supply capacitor CS9 via an internal diode. As soon as VVS exceeds VVS(start), the circuit starts oscillating. After the preheat phase is finished, pin RHV is connected to an internal resistor Ri(RHV); prior to this, pin RHV is internally connected to pin VS. The voltage level at pin RHV thus drops from VVS + Vdiode to IRHV x Ri(RHV). The capacitor CS9 at pin VS will now be charged via the snubber capacitor CS7. Excess charge is drained by an internal clamp that turns on at voltage VVS(clamp). Minimum gate-source voltage of T1 and T2 The high side driver is supplied via capacitor Cboot. Capacitor Cboot is charged via the bootstrap switch during the on-periods of T2. The IC stops oscillating at a voltage level VVS(stop). Given a maximum charge consumption on the load at pin G1 of 1 nC/V, this safeguards the minimum drive voltages V(G1-S1) for the high side driver; see Table 1. Table 1 Minimum gate-source voltages VOLTAGE 8 V (min.) 7 V (min.) 6 V (min.) Ground pins
UBA2021
Pin PGND is the ground reference of the IC with respect to the application. As an exception, pin SGND provides a local ground reference for the components connected to pins CP, CI, RREF and CF. For this purpose pins PGND and SGND are short-circuited internally. External connection of pins PGND and SGND is not preferred. The sum of currents flowing out of the pins CP, CI, RREF, CF and SGND must remain zero at any time. Charge coupling Due to parasitic capacitive coupling to the high voltage circuitry, all pins are burdened with a repetitive charge injection. Given the typical application in Fig.7, pins RREF and CF are sensitive to this charge injection. For the rating Qcouple a safe functional operation of the IC is guaranteed, independent of the current level. Charge coupling at current levels below 50 A will not interfere with the accuracy of the VRS(cap) and VRS(ctrl) levels. Charge coupling at current levels below 20 A will not interfere with the accuracy of any parameter.
FREQUENCY <75 kHz 75 kHz to 85 kHz 85 kHz
The drive voltage at G2 will exceed the drive voltage of the high side driver. Frequency and change in frequency At any point in time during oscillation, the circuit will operate between fB and fstart. Any change in frequency will be gradual, no steps in frequency will occur. Changes in frequency caused by a change in voltage at pin CI show a rather-constant df/dt over the entire frequency range. The following rates are realised (at a frequency of 85 kHz and with a 100 nF capacitor connected to pin CI): * For any increase in frequency: df/dt is between 15 and 37.5 kHz/ms * During preheat and normal operation: df/dt for a decrease in frequency is between -6 and -15 kHz/ms * During the ignition phase: df/dt for a decrease in frequency is between -150 and -375 Hz/ms.
2001 Jan 30
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Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
UBA2021
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages referenced to ground. SYMBOL VFS IVS(clamp) VRS SR P Tamb Tj Tstg Qcouple Ves PARAMETER high side floating supply voltage clamp current input voltage pin RS transient of 50 ns slew rate at pins S1, G1 and FS (with respect to ground) power dissipation ambient temperature junction temperature storage temperature charge coupling at pins RREF and CF electrostatic handling voltage operating machine model; note 2 Notes 1. Human body model: all pins are 3000 V maximum, except pins FS, G1, S1 and VS which are 1500 V maximum and pin G2 which is 1000 V maximum. 2. Machine model: all pins are 300 V maximum, except pin G2 which is 125 V maximum. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) SO14 DIP14 Rth(j-pin) thermal resistance from junction to pcb SO14 DIP14 QUALITY SPECIFICATION In accordance with "SNW-FQ-611-E". in free air 50 30 K/W K/W PARAMETER thermal resistance from junction to ambient in free air 100 60 K/W K/W CONDITIONS VALUE UNIT CONDITIONS operating t 0.5 s t 0.5 s - - - -2.5 -15.0 -4 - -40 -40 -55 -8 - human body model; note 1 - MIN. MAX. 570 630 35 +2.5 +2.5 +4 500 +150 +150 +150 +8 3000 300 V V mA V V V/ns mW C C C pC V V UNIT
2001 Jan 30
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Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
UBA2021
CHARACTERISTICS VVS = 11 V; VFS - VS1 = 11 V; Tamb = 25 C; all voltages referenced to ground; see Fig.7; unless otherwise specified. SYMBOL High voltage supply IL Start-up state VVS(reset) VVS(start) VVS(stop) VVS(hys) IVS(standby) V(RHV-VS) VVS(clamp-start) IVS(clamp) Preheat mode fstart tg ICI(charge) ICI(discharge) tph ICP(charge) ICP(discharge) VCP(pk) VRS(ctrl) ICI(charge) fB tign fB tg tno Itot VRS(cap) VRREF VG1(on) VG1(off) VG2(on) VG2(off) RG1(on) 2001 Jan 30 starting frequency conducting time T1 and T2 charge current at pin CI discharge current at pin CI preheat time charge current at pin CP discharge current at pin CP peak voltage difference at pin CP control voltage at pin RS VCP = 1 V VCP = 1 V when timing note 3 VCI = 1.5 V; f 85 kHz VCI at clamp level VCI = 0 V fstart = 108 kHz VCI = 1.5 V; VRS = -0.3 V VCI = 1.5 V; VRS = -0.9 V 98 - 38 79 599 - - - -636 0.8 - - 42.21 fB = 43 kHz fB = 43 kHz; note 4 note 5 note 6 IG1 = 1 mA IG1 = 1 mA IG2 = 1 mA IG2 = 1 mA V(G1 - S1) = 3 V; note 7 9 - 1.05 0.85 0 2.425 10.5 - 10.5 - 100 108 3.2 44 93 666 6.0 5.95 2.5 -600 1.0 42.9 625 118 - 50 107 733 - - - -564 1.2 - - 44.59 - 1.75 1.1 40 2.575 - 0.3 - 0.3 152 kHz s A A ms A A V mV A kHz ms reset voltage oscillator start voltage oscillator stop voltage supply voltage hysteresis standby supply current at pin VS VVS = 11 V; note 1 voltage difference between pins RHV IRHV = 1.0 mA and VS clamp margin VVS(clamp) to VVS(start) clamp current note 2 VVS < 17 V T1 off; T2 on 4.0 11.35 9.55 1.5 150 0.7 0.2 - 5.5 11.95 10.15 1.8 200 0.8 0.3 14 6.5 12.55 10.75 2.0 250 1.0 0.4 35 V V V V A V V mA leakage current on high voltage pins VFS, VG1 and VS1 = 630 V - - 15 A PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Frequency sweep to ignition charge current at pin CI bottom frequency ignition time
Normal operation bottom frequency conducting time T1 and T2 non-overlap conductance time total supply current capacitive mode control voltage reference voltage on voltage at pin G1 off voltage at pin G1 on voltage at pin G2 off voltage at pin G2 high side driver on resistance 42.90 10.2 1.4 1.0 20 2.5 - - - - 126 kHz s s mA mV V V V V V
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
UBA2021
SYMBOL RG1(off) RG2(on) RG2(off) Vdrop Feed-forward Ri(RHV) Ii(RHV) fff SYMff RR RCP(sw) RAV Notes
PARAMETER high side driver off resistance low side driver on resistance low side driver off resistance voltage drop at bootstrap switch
CONDITIONS V(G1 - S1) = 3 V; note 7 VG2 = 3 V; note 7 VG2 = 3 V; note 7 IFS = 5 mA
MIN. 60 100 60 0.6
TYP. 75 126 75 1.0
MAX. 90 152 90 1.4
UNIT V
input resistance at pin RHV operating range of input current at pin RHV feed-forward frequency symmetry ripple rejection CP switch series resistance averaging resistor note 8 IRHV = 0.75 mA IRHV = 1 mA IRHV = 1 mA; note 9 fVin = 100 Hz ICP = 100 A ICP = 10 A
1.54 0 60.4 80.3 0.9 - 0.75 22.4
2.2 - 63.6 84.5 1.0 6 1.5 32
2.86 1000 66.15 88.2 1.1 - 2.25 41.6
k A kHz kHz dB k k
1. The start-up supply current is specified in a temperature (Tvj) range of 0 to 125 C. For Tvj <0 and Tvj >125 C the start-up supply current is <350 A. 2. The clamp margin is defined as the voltage difference between turn-on of the clamp and start of oscillation. The clamp is in the off-state at start of oscillation. 3. Data sampling of VRS(ctrl) is performed at the end of conduction of T2. 4. The total supply current is specified in a temperature (Tvj) range of -20 to +125 C. For Tvj < -20 and Tvj >125 C the total supply current is <1.5 mA. 5. Data sampling of VRS(cap) is performed at the start of conduction of T2. 6. Within the allowed range of RRREF, defined as 30 k +10%. 7. Typical values for the on and off resistances at Tvj = 87.5 C are: RG2(on) and RG1(on) = 164 , RG2(off) and RG1(off) = 100 . 8. The input current at pin RHV may increase to 1600 A during voltage transient at Vin. Only for currents IRHV beyond approximately 550 A is the oscillator frequency proportional to IRHV. 9. The symmetry SYMff is calculated from the quotient SYMff = T1tot/T2tot, with T1tot the time between turn-off of G2 and turn-off of G1, and T2tot the time between turn-off of G1 and turn-off of G2.
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Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
DESIGN EQUATIONS 1 * Bottom frequency: f B = -------------------------------------------------------------------------------------------------------------------------2 x { [ ( C CF + C par ) x ( X1 x R RREF - R int ) ] + } 1 * Feed-forward frequency: f ff = --------------------------------------------------------------------------------------------------------------------------X2 x V RREF ------------------------------ - R + 2 x ( C CF + C par ) x int I i ( RHV ) Where: - X1 = 3.68 - X2 = 22.28 - = 0.4 s - Rint = 3 k - Cpar = 4.7 pF * Operating frequency is the maximum of fB, fff or fcm Where: - fB = bottom frequency - fff = feed-forward frequency - fcm = frequency due to capacitive mode detection C CP R RREF * Preheat time: t ph = ----------------- x ----------------150 nF 30 k 15 * Ignition time: t ign = ----- x t ph 16 R RREF * Non-overlap time: t no = 1.4 s x ----------------30k
UBA2021
2001 Jan 30
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Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
APPLICATION INFORMATION
UBA2021
handbook, full pagewidth
L1
Vin
RRHV 490 k RHV CI 13 14
DS1
DS2
T1 C3 lamp
G1
CCI 100 nF
2
R1 mains supply L2 C2 C5 T2 DS7 DS3 DS4 C4 CS4 Rshunt DS6 CS7 100 nF
S1
3
8
CP
CCP 100 nF CCF 100 pF
FS 1 Cboot G2
UBA2021 12 CF
6
10
RREF
RRREF 30 k
VS CS9
5
7 PGND
9 11 RS
SGND
MGS994
Fig.7 Application diagram.
2001 Jan 30
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Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
PACKAGE OUTLINES SO14: plastic small outline package; 14 leads; body width 3.9 mm
UBA2021
SOT108-1
D
E
A X
c y HE vMA
Z 14 8
Q A2 A1 pin 1 index Lp 1 e bp 7 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
inches 0.069
0.010 0.057 0.004 0.049
0.019 0.0100 0.35 0.014 0.0075 0.34
0.244 0.039 0.041 0.228 0.016
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-22 99-12-27
2001 Jan 30
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Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
UBA2021
DIP14: plastic dual in-line package; 14 leads (300 mil)
SOT27-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 14 8 MH wM (e 1)
pin 1 index E
1
7
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT27-1 REFERENCES IEC 050G04 JEDEC MO-001 EIAJ SC-501-14 EUROPEAN PROJECTION A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.13 0.068 0.044 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
ISSUE DATE 95-03-11 99-12-27
2001 Jan 30
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Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. Surface mount packages REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
UBA2021
Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
2001 Jan 30
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Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
Suitability of IC packages for wave, reflow and dipping soldering methods
UBA2021
SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. suitable(2) not suitable not suitable(3) suitable not recommended(4)(5) not recommended(6) REFLOW(1) DIPPING - suitable suitable suitable suitable suitable suitable - - - - -
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Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development DEFINITIONS (1)
UBA2021
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2001 Jan 30
17
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
NOTES
UBA2021
2001 Jan 30
18
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
NOTES
UBA2021
2001 Jan 30
19
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2001
Internet: http://www.semiconductors.philips.com
SCA 71
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613502/02/pp20
Date of release: 2001
Jan 30
Document order number:
9397 750 07752

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